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6 days ago
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MTS - Product/Integration Engineer


Simply Recruitment Partner
Salary band: $10k - $15k
Location: North America, United States, Florida
Job type: Permanent
Contact: Aurora Semiconductor
Category: Engineer
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Job Description

Purpose of the Job:

We are seeking product/integration engineer who has experience and expertise in semiconductor process integration and fabrication. Selected candidate will join our fast-paced engineering team that develops, designs, and manufactures heterogeneous system in package modules for defense and commercial applications. This is a hands-on engineering position, requiring proficiency in semiconductor process integration, as well as strong communication and presentation skills. The preferred candidate will be highly motivated with an excellent track record of performance and innovation, as well as be passionate about developing and producing best- in- class products. Must have or be able to obtain & maintain U.S. Government Secret Clearance.

Job Responsibilities:

  • Ensure testability and manufacturability of system in package module from proof of concept stage through production ramp.

  • Make significant contributions to design, development and validation of testability modules.

  • Analyzes and evaluates specification versus performance to ensure optimal match of requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.

  • Interface with customers to understand device window requirements, and providing technical support.

  • Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment.

  • Statistical analysis of key parameter input/output variables (KPIV/KPOV)

  • Use contemporary and industry standard process monitoring tools to statistically evaluate the performance of a manufacturing cell or module

  • Complete NPI design-oriented activities, including specifications, product/design FMEAs, DFX, qualification plans, drawings, test requirements, etc.

  • Understand all technical details of products - ranging from initial designs to volume production issues.

  • Collaborate with development and manufacturing engineer teams to determine development and build schedules

  • Continue process optimization and improvement.

  • Lead improvements in reliability based on FA and internal NCMs establishing root cause failures and appropriate corrective actions.

  • Monitor and maintain technology reliability and stability.

  • Review and improve E-test performance on production wafers.

  • Review production data with Process Engineering (e.g., yield, cycle time, DL hours) across entire manufacturing process to facilitate continual improvement plans.

  • Ensures products meet cost targets, performance specifications, expected reliability, and quality goals.

  • Assist in development of systems to maintain reports and record the company's product/process data.

  • Establish disciplined Six Sigma (DMAIC, SPC, DOE, Gage R&R, etc.) approach to improvement and use 8 Disciplines of problem solving or equivalent tools to manage engineering activities.

  • Manage multiple projects with multi-disciplinary indirectly reporting team members.

  • Work closely with others in a very cross-functional team environment to implement new process technologies

  • Develop new process integration concepts for a variety of module technologies.

  • Serve as a vital part of a growing team of engineers and technologists creating state of the art heterogeneous system in package

  • Keen attention to details, with a conscious focus towards efficiency and convergence via methodologies, standardization, and proliferation of best practices across products and product segments

  • Create and present technical reports.

Qualifications:

  • Active U.S. Government "Secret" security clearance (or ability to obtain and maintain)

  • 7 - 10 years relevant experience

  • MS or PhD in Engineering field (Electrical or Mechanical)

  • Six Sigma classification highly desirable

  • Problem solving with sound logical thinking and analysis

  • Excellent communication skills, verbal and written

  • Semiconductor Processing and Integration

  • Semiconductor Device Physics (preferred)

  • Assembly process experience is a plus

  • Ability to work in a multi-disciplined engineering environment

  • Excellent listening and collaboration skills

  • Highly organized with the ability to work in a fast-paced, multi-tasking environment

  • Familiarity with a wide variety of materials and processes to best achieve the design goals and product specifications

  • Experience with Product Data Management (PDM)

  • Program and Project Management competency coordinating teams across organizational boundaries and working within a matrix organization

  • Prior experience/exposure to high volume manufacturing

  • Competency in using Visual Basic, MS Excel, PDM, MS Word, SQL, Computer-Aided Design (CAD), etc.

Compensation:

  • Base salary $90K - $100K

  • Bonus

Company Description
Advanced semiconductor manufacturing, supporting U.S. Government (classified) and commercial (i.e. medical technology, automotive , mass server users, internet of things) customers.
Job Description

Purpose of the Job:

We are seeking product/integration engineer who has experience and expertise in semiconductor process integration and fabrication. Selected candidate will join our fast-paced engineering team that develops, designs, and manufactures heterogeneous system in package modules for defense and commercial applications. This is a hands-on engineering position, requiring proficiency in semiconductor process integration, as well as strong communication and presentation skills. The preferred candidate will be highly motivated with an excellent track record of performance and innovation, as well as be passionate about developing and producing best- in- class products. Must have or be able to obtain & maintain U.S. Government Secret Clearance.

Job Responsibilities:

  • Ensure testability and manufacturability of system in package module from proof of concept stage through production ramp.

  • Make significant contributions to design, development and validation of testability modules.

  • Analyzes and evaluates specification versus performance to ensure optimal match of requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.

  • Interface with customers to understand device window requirements, and providing technical support.

  • Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment.

  • Statistical analysis of key parameter input/output variables (KPIV/KPOV)

  • Use contemporary and industry standard process monitoring tools to statistically evaluate the performance of a manufacturing cell or module

  • Complete NPI design-oriented activities, including specifications, product/design FMEAs, DFX, qualification plans, drawings, test requirements, etc.

  • Understand all technical details of products - ranging from initial designs to volume production issues.

  • Collaborate with development and manufacturing engineer teams to determine development and build schedules

  • Continue process optimization and improvement.

  • Lead improvements in reliability based on FA and internal NCMs establishing root cause failures and appropriate corrective actions.

  • Monitor and maintain technology reliability and stability.

  • Review and improve E-test performance on production wafers.

  • Review production data with Process Engineering (e.g., yield, cycle time, DL hours) across entire manufacturing process to facilitate continual improvement plans.

  • Ensures products meet cost targets, performance specifications, expected reliability, and quality goals.

  • Assist in development of systems to maintain reports and record the company's product/process data.

  • Establish disciplined Six Sigma (DMAIC, SPC, DOE, Gage R&R, etc.) approach to improvement and use 8 Disciplines of problem solving or equivalent tools to manage engineering activities.

  • Manage multiple projects with multi-disciplinary indirectly reporting team members.

  • Work closely with others in a very cross-functional team environment to implement new process technologies

  • Develop new process integration concepts for a variety of module technologies.

  • Serve as a vital part of a growing team of engineers and technologists creating state of the art heterogeneous system in package

  • Keen attention to details, with a conscious focus towards efficiency and convergence via methodologies, standardization, and proliferation of best practices across products and product segments

  • Create and present technical reports.

Qualifications:

  • Active U.S. Government "Secret" security clearance (or ability to obtain and maintain)

  • 7 - 10 years relevant experience

  • MS or PhD in Engineering field (Electrical or Mechanical)

  • Six Sigma classification highly desirable

  • Problem solving with sound logical thinking and analysis

  • Excellent communication skills, verbal and written

  • Semiconductor Processing and Integration

  • Semiconductor Device Physics (preferred)

  • Assembly process experience is a plus

  • Ability to work in a multi-disciplined engineering environment

  • Excellent listening and collaboration skills

  • Highly organized with the ability to work in a fast-paced, multi-tasking environment

  • Familiarity with a wide variety of materials and processes to best achieve the design goals and product specifications

  • Experience with Product Data Management (PDM)

  • Program and Project Management competency coordinating teams across organizational boundaries and working within a matrix organization

  • Prior experience/exposure to high volume manufacturing

  • Competency in using Visual Basic, MS Excel, PDM, MS Word, SQL, Computer-Aided Design (CAD), etc.

Compensation:

  • Base salary $90K - $100K

  • Bonus

Company Description
Advanced semiconductor manufacturing, supporting U.S. Government (classified) and commercial (i.e. medical technology, automotive , mass server users, internet of things) customers.

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